MPLAB ICE 2000 Processor Module and Device Adapter Specification CONTENTS 2.0 MPLAB ICE 2000 SYSTEM 1.0 Introduction ......................................................... 1 A brief overview of the different components of the system is shown in the figure below. Each component 2.0 MPLAB ICE 2000 System................................... 1 is discussed in the following subsections. 3.0 Emulator-Related Issues .................................... 2 FIGURE 2-1: MPLAB ICE 2000 4.0 Processor Modules ............................................. 2 EMULATOR SYSTEM 5.0 Device Adapter Issues........................................ 4 Communications Cable 6.0 Device Adapter Target Footprints ..................... 10 Emulator Pod Processor Module 1.0 INTRODUCTION with Cable The processor modules for MPLAB ICE 2000 are Power Supply Cable interchangeable personality modules that allow Logic Probe MPLAB ICE 2000 to be reconfigured for emulation of Connector different PICmicro microcontrollers (MCUs). This modularity allows the emulation of many different devices with the addition of a processor module and Device Adapter device adapter, which provides a very cost effective Transition Socket multiprocessor emulation system. The device adapters for MPLAB ICE 2000 are inter- 2.1 Host to Pod Cable changeable assemblies that allow the emulator system This is a standard parallel interface cable. MPLAB ICE to interface to a target application system. Device 2000 is tested with a 6-foot cable. A longer cable may adapters also have control logic that allows the target work, but is not ensured. The cable connects to a par- application to provide a clock source and power to the allel port on the PC. If a PC has a printer connected to processor module. The device adapters support an LPT device, it is recommended that an additional PICmicro MCUs in DIP, SDIP and PLCC packages. interface card be installed, rather than using a splitter Transition sockets, used along with a device adapter, or an A/B switch. provide a method of accommodating all PICmicro MCU packages, including SOIC, SSOP, PQFP and TQFP 2.2 Emulator Pod packages. The Emulator Pod contains emulator memory and control logic. MPLAB ICE 2000 contains a main board and an additional board for expanded trace memory and complex control logic. There are no field service- able parts in the pod. For more information on the pod, see the MPLAB ICE 2000 on-line help file in MPLAB IDE (Help>Topics) or the MPLAB ICE 2000 In-Circuit Emulator Users Guide (DS51488). The MPLAB ICE 2000 processor module is inserted into the pod for operation. 2.3 Processor Module The processor module contains the emulator chip, logic and low-voltage circuitry. There are no field-serviceable parts mounted on the printed circuit board housed within the processor module enclosure. 2006 Microchip Technology Inc. DS51140M-page 1 MPLAB ICE 2000 2.4 Flex Circuit Cable 3.0 EMULATOR-RELATED ISSUES General limitations that apply to the MPLAB ICE 2000 Once the processor module is inserted into the emulator may be found in the on-line help. Select emulator pod, the flex circuit cable extends the Help>Topics and then select MPLAB ICE 2000 under emulator system to the target application. This is a Debuggers. custom cable that is attached inside the processor module enclosure, and can be replaced in the field by Device-specific limitations can be found as above or by removing the end cap of the processor module selecting Debugger>Settings, clicking the Limitations enclosure. tab, and then clicking the Details button. Please, DO NOT PULL on the flex circuit cable to remove the processor module from the pod. Use the 4.0 PROCESSOR MODULES fins of the processor module end cap to leverage the Processor modules are identified on the top of the module from the pod. assembly (e.g., PCM18XA0). To determine which Emulator analog functions may not operate within the processors are supported by a specific module, refer to performance specifications published in the device the file Readme for MPLAB ICE 2000.txt in the data sheet due to parasitic capacitance (up to 120 pf) MPLAB IDE installation directory or the latest Product of the flex cable. Selector Guide (DS00148), which can be found on the Microchip web site at www.microchip.com. 2.5 Device Adapter A typical processor module contains a special bond-out The device adapter provides a common interface for version of a PICmicro MCU, with device buffers to the device being emulated. It is provided in standard control data flow and control logic. It provides the DIP and PLCC styles. The adapter also contains a spe- means of configuring the MPLAB ICE 2000 emulator cial device that provides an oscillator clock to accu- for a specific PICmicro MCU family and handles rately emulate the oscillator characteristics of the low-voltage emulation when needed. PICmicro MCU. Note: When removing the processor module, DO Due to components on the device adapter, which NOT PULL on the flex cable. Use the tabs require target power, the device adapter should be on the processor module or damage to the removed from the flex circuit cable (see Figure 2-1) flex cable may occur. when emulator power is being used and the processor module is not connected to the target. This will 4.1 Power eliminate any loading effects on I/O pins. The operating voltage for most of the control logic and 2.6 Transition Socket buffering on the processor module is +5V and is supplied by the emulator pod. Power to the emulator Transition Sockets are available in various styles to processor and some of its surrounding buffers is user- allow a common device adapter to be connected to one selectable, and can be powered by the emulator pod of the supported surface mount package styles. Transi- (at +5V only) or the target application system (from tion sockets are available for various pin counts and 2.0V to 5.5V). This is software selectable and is pitches for SOIC, QFP and other styles. For more infor- configurable through the MPLAB IDE software. At no mation on transition sockets, see the MPLAB ICE time will the emulator system directly power the target 2000/4000 Transition Socket Specification (DS51194). application system. ALWAYS insert the processor An emulator system consists of the following module into the emulator pod before applying power to components which can be ordered separately: the pod. An emulator pod (including the host-to-pod cable When connecting to a target application system, there and power supply) may be a voltage level on the target application even A processor module (including the flex circuit though power has not yet been applied to the target cable) application circuit. This is normal, and is due to current leakage through VCC of the device adapter. The current A device adapter leakage will typically be less than 20 mA. However, if An optional transition socket (for surface mount the target application is using a voltage regulator, it emulation) should be noted that some regulators require the use of an external shunt diode between VIN and VOUT for reverse-bias protection. Refer to the manufacturers data sheets for additional information. DS51140M-page 2 2006 Microchip Technology Inc.