Product Information

MTW32N20EG

MTW32N20EG electronic component of ON Semiconductor

Datasheet
MOSFET NFET T0247 200V 32A 75mOhm

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (JPY)

1: ¥ 1272.6727 ea
Line Total: ¥ 1272.6727

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Tue. 03 Oct to Mon. 09 Oct

MOQ : 1
Multiples : 1

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MTW32N20EG
ON Semiconductor

1 : ¥ 1272.6727
10 : ¥ 1179.943
50 : ¥ 987.2254
100 : ¥ 916.3239

     
Manufacturer
ON Semiconductor
Product Category
MOSFET
RoHS - XON
Y Icon ROHS
Id - Continuous Drain Current
32 A
Vds - Drain-Source Breakdown Voltage
200 V
Rds On - Drain-Source Resistance
75 mOhms
Transistor Polarity
N - Channel
Vgs - Gate-Source Breakdown Voltage
20 V
Minimum Operating Temperature
- 55 C
Maximum Operating Temperature
+ 150 C
Pd - Power Dissipation
180 W
Mounting Style
Through Hole
Package / Case
TO - 247 - 3
Packaging
Tube
Channel Mode
Enhancement
Configuration
Single
Brand
On Semiconductor
Forward Transconductance - Min
12 S
Fall Time
91 ns
Rise Time
120 ns
Factory Pack Quantity :
30
Typical Turn-Off Delay Time
75 ns
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MTW32N20E Power MOSFET 32 Amps, 200 Volts N Channel TO247 This advanced Power MOSFET is designed to withstand high MTW32N20E ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS DrainSource Breakdown Voltage V (BR)DSS 200 Vdc (V = 0 V, I = 250 Adc) GS D Temperature Coefficient (Positive) 247 mV/C Zero Gate Voltage Drain Current I Adc DSS (V = 200 Vdc, V = 0) 250 DS GS (V = 200 Vdc, V = 0, T = 125C) 1000 DS GS J GateBody Leakage Current (V = 20 Vdc, V = 0) I 100 nAdc GS DS GSS ON CHARACTERISTICS (Note 1) Gate Threshold Voltage V GS(th) (V = V , I = 250 Adc) 2.0 4.0 Vdc DS GS D Temperature Coefficient (Negative) 8.0 mV/C Static DrainSource OnResistance (V = 10 Vdc, I = 16 Adc) R 0.064 0.075 GS D DS(on) DrainSource OnVoltage (V = 10 Vdc) V Vdc GS DS(on) (I = 32 Adc) 3.0 D (I = 16 Adc, T = 125C) 2.7 D J Forward Transconductance (V = 15 Vdc, I = 16 Adc) g 12 mhos DS D FS DYNAMIC CHARACTERISTICS Input Capacitance C 3600 5000 pF iss Output Capacitance C 690 1000 (V = 25 Vdc, V = 0, f = 1.0 MHz) oss DS GS Reverse Transfer Capacitance C 130 250 rss SWITCHING CHARACTERISTICS (Notes 1 & 2) TurnOn Delay Time t 25 50 ns d(on) Rise Time t 120 240 r (V = 100 Vdc, I = 32 Adc, DD D V = 10 Vdc, R = 6.2 ) GS G Turn Off Delay Time t 75 150 d(off) Fall Time t 91 182 f Gate Charge Q 85 120 nC T Q 12 1 (V = 160 Vdc, I = 32 Adc, DS D V = 10 Vdc) GS Q 40 2 Q 30 3 SOURCEDRAIN DIODE CHARACTERISTICS (Note 1) Forward OnVoltage V Vdc SD (I = 32 Adc, V = 0) S GS 1.1 2.0 (I = 16 Adc, V = 0, T = 125C) S GS J 0.9 Reverse Recovery Time t 280 ns rr t 195 a (I = 32 Adc, V = 0, dI /dt = 100 A/ s) S GS S t 85 b Reverse Recovery Stored Charge Q 2.94 C RR INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance L 5.0 nH D (Measured from the drain lead 0.25 from package to center of die) Internal Source Inductance L 13 nH S (Measured from the source lead 0.25 from package to source bond pad) 1. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 2. Switching characteristics are independent of operating junction temperature.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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